Percutaneous argon-helium knife treatment of liver cancer is one of the non-surgical treatment methods in recent years, which indicates that the treatment of liver cancer has entered a new stage of cryotherapy. Professor Yang Yongping, director of the Department of Hepatology and Medicine, Fifth Medical Center, General Hospital of Chinese People’s Liberation Army, shared the cryoablation treatment of liver cancer in the first multi-disciplinary cooperation forum of Anhui Province, and the platform of treating liver cancer with sincerity specially compiled the essence for readers.

Overview of liver cancer

In China, hepatocellular carcinoma (HCC) is the fifth largest malignant tumor and the second largest tumor-related death cause, with a five-year survival rate of only 14.2%. How to treat liver cancer scientifically and benefit the long-term survival of patients is an important clinical problem, and it is also the gold standard to measure the treatment level of medical units. In 2022, the updated guidelines for prognosis and treatment strategy of clinical liver cancer (BCLC) in Barcelona proposed that patients with HCC should be accurately evaluated individually. Doctors need to fully consider the scope and load of the tumor, the nutritional status and human performance of the patient, complications, age, etc., and formulate individualized treatment methods for the patient.

No matter what stage the patient is in, local ablation is an important treatment. At present, a variety of mature local ablation treatment techniques for liver cancer have been formed, including radiofrequency ablation, microwave ablation, cryoablation, irreversible electroporation (nano-knife) and so on.

Overview of cryoablation therapy

Cryoablation therapy has experienced a long development process. In 1800, James Arnott discovered that the mixture of ice and salt could delay the progress of breast cancer, uterine cancer and skin cancer. In 1950, liquid nitrogen and dry ice were used to treat different kinds of diseases, especially benign skin lesions. In 1961, Cooper and Le introduced the first automatic cryosurgical equipment, but it used liquid nitrogen as refrigerant, which had many complications and was only used in laparotomy. In the 1970s and 1980s, liquid nitrogen needle was used to treat prostate hypertrophy and prostate cancer, but the cryoablation technology was stagnant due to many complications. In the 1990s, intraoperative ultrasound monitoring of freezing process was used in surgery by scholars, and argon was studied as the refrigerant. In 1998, the third generation cryosurgery system (Argon-Helium cryosurgery system) came out in the United States, which used argon as the refrigerant and helium as the heat medium, bringing revolutionary progress to minimally invasive cryosurgery. In 2000, cryotherapy entered American medical insurance. In 2003, the World Congress of Targeted Cancer Therapy recommended cryoablation as the first choice for advanced lung cancer and liver cancer. In 2010, the standardized diagnosis and treatment of liver cancer promoted by the Health Planning Commission listed cryoablation as a local treatment for liver cancer. In 2016, after more than 10 years of unremitting efforts, Professor Yang Yongping’s team led the overall and comprehensive innovation and development of percutaneous cryoablation of liver cancer at home and abroad, changed the international prejudice on cryoablation of liver cancer, turned the small path into the big road, the irregular into the norm, and the unpopular into the hot spot.The technological innovation of cryoablation of liver cancer won the first prize of Beijing Science and Technology Progress Award. In 2018, 2019 and 2020, experts’ consensus on imaging-guided cryoablation for lung cancer, experts’ consensus on imaging-guided cryoablation for bone and soft tissue tumors, experts’ consensus on imaging-guided cryoablation for kidney cancer and experts’ consensus on imaging-guided cryoablation for liver cancer were released respectively. So far, NCCN, AASLD, APASL, EASL and other guidelines have recommended cryoablation for the treatment of primary liver cancer.

At present, the Department of Hepatology Medicine of the General Hospital of the Chinese People’s Liberation Army has become the largest medical center for treating liver tumors in the world last year, constantly exploring the innovation of cryoablation technology, adopting high-vacuum heat insulation technology, only destroying the tumor site without damaging the surgical path, and adopting multi-stage heat exchange technology, which makes the refrigerant utilization rate higher and the cooling rate faster, and it is easier to induce the frozen immune response of liver cancer patients, activate their own anti-tumor immunity and produce ectopic tumor inhibition.

Therapeutic mechanism and characteristics of cryoablation technology

The cryoablation area is composed of central coagulative necrosis area and peripheral tissue injury area with different degrees. The mechanism of rapid direct cell necrosis in the central area includes mechanical damage caused by ice crystal formation inside and outside the cell and osmotic damage caused by dehydration and rupture of the cell. Peripheral injury areas are mainly related to freezing-related secondary injuries, including hypoxia death of tumor tissue caused by blood embolism, apoptosis caused by reversible injury, and waterfall-like ectopic tumor suppression by stimulating immune regulation.

The characteristics of cryoablation technology include: ① clear treatment boundary, real-time monitoring under image, safe and reliable treatment; ② Treatment can stimulate human immunity and strengthen tumor treatment; ③ Physical therapy is non-toxic to human body, with extremely low side effects; ④ The treatment is painless, without general anesthesia and participation of anesthesiologists, and the treatment is convenient; ⑤ Not limited by the artificial pacemaker installed in the body; ⑥ Effective, suitable for lung cancer, liver cancer, kidney cancer, breast cancer, prostate cancer and other solid tumors.

In addition, ultrasound, CT, laparoscopy or intraoperative direct vision guidance can be used for cryoablation treatment, and the tumor position and the formation of ice hockey can be monitored in real time.

Current situation of percutaneous cryoablation of HCC

Before 2005, based on the previously reported clinical research results, there were many complications, such as bleeding, liver parenchyma frost crack, freezing shock, coagulation dysfunction and so on. International scholars were cautious about this technology. After 2005, percutaneous cryoablation for liver cancer has developed in China, especially with the publication of China’s continuous clinical summary and high-level evidence in the top international journal Hepatology. More and more clinical studies have confirmed that percutaneous cryoablation for liver cancer is safe and effective, and international scholars have a positive attitude.

Professor Yang Yongping’s team took the lead in conducting clinical research to determine the indications of liver cirrhosis-related HCC by percutaneous cryoablation. In this study, 1681 patients with liver cirrhosis-related HCC and 682 patients with advanced HCC were selected, and the indications and standards of complete cryoablation and selective cryoablation were established. It was proposed that the ablation volume of the target lesion should exceed 50% of the tumor volume or minimize the tumor load, relieve the symptoms caused by the tumor, improve the quality of life and prolong the survival time. The study also innovatively changed the percutaneous puncture to guide needle to locate the introduction of vascular sheath to solve the problem of bleeding after cryoablation, which has been cited by foreign counterparts for many times and suggested routine application.

Indications for complete cryoablation of liver cancer:

① The maximum diameter of a single tumor is less than 5 cm, or the number of tumors is less than 3, and the maximum diameter is less than 3 cm;

② Recurrence after surgical resection or other local treatment meets the conditions ①;

③ Child-Pugh A or B of liver function, bilirubin level ≤51.3μmol/L, or reaching this standard after medical treatment;

④ The blood coagulation function is good (prothrombin activity > 40%, platelet count > 30×109//L, using sheath hemostasis and packing system);

⑤ECOG PS ≤2；

⑥ Cirrhosis, including a history of chronic liver disease, with enlarged hepatic fissure/metacentric colon/esophageal varices/gastric varices/serrated liver surface, a history of upper gastrointestinal bleeding or ascites, and platelets < 100×109/L..

Indications for selective cryoablation of liver cancer:

① Single tumor with a maximum diameter of > 5cm or multiple tumors with a maximum diameter of > 3cm that cannot be surgically removed, regardless of whether there is tumor thrombus in portal vein;

② Child-Pugh A or B liver function classification, bilirubin level ≤51.3μmol/L or reaching the standard after medical treatment;

③ The blood coagulation function is good (prothrombin activity > 40%, platelet count > 30×109/L, using sheath hemostasis and packing system);

④QECOG PS ≤2；

⑤ Cirrhosis, including a history of chronic liver disease, with widened hepatic fissure/metacentric colon/esophageal varices/gastric varices/serrated liver surface, a history of upper gastrointestinal bleeding or ascites, and platelets < 100×109/L..

In addition, Professor Yang Yongping’s team innovatively established measures to prevent and treat complications of percutaneous cryoablation of hepatocellular carcinoma. In this study, 3321 patients were selected, and the measures of percutaneous cryoablation of liver cancer complications were established and verified (Table 1).

Table 1 Measures for Complications of Percutaneous Cryoablation of Liver Cancer

Moreover, the study has achieved encouraging clinical results, which increased the complete tumor ablation rate by 10.6%, reduced the local tumor recurrence rate by 30.3% in 5 years, and improved the 5-year survival rate by 16.6%.

Advantages of cryoablation in the treatment of hepatocellular carcinoma

Although cryoablation has distinct advantages over radiofrequency ablation (RFA), there is no RCT study in the past to directly compare the efficacy of ablation of liver cancer, especially the safety. Professor Yang Yongping’s team designed RCT study in five years to evaluate the efficacy and safety of percutaneous cryoablation and radiofrequency ablation of liver cancer. For the tumor, there were statistical differences in the local tumor progression rate between the two groups at 1, 2 and 3 years: 3%, 7% and 7% in the frozen group, respectively; The RF group was 9%, 11% and 11% respectively (P = 0.043). Subgroup analysis: For hepatocellular carcinoma with a diameter of > 3cm, cryoablation has a lower local tumor progression rate (cryoablation vs. RF: 7.7% vs. 18.2%, P=0.041). There was no statistical difference in the local tumor progression rate between 1-2cm (frozen vs. RF: 0% vs.2.4%, P=1.000) and 2.1-3.0cm (frozen vs. RF: 4.1%vs.7.1%, P=0.656). The results were published in Hepatology magazine and also in China.

Professor Yang Yongping’s team also confirmed that cryoablation of HCC can produce ectopic tumor inhibition, with the incidence of ectopic tumor inhibition of 6.3%, and the median survival time of patients with ectopic tumor inhibition was significantly prolonged. The mechanism is related to the down-regulation of PD-1/PD-L1 and regulatory T cells after ablation. In addition, argon-helium cryotherapy is effective for elderly HCC.

Unresolved problems in cryoablation of HCC

There are also many problems to be solved in the process of cryoablation for HCC in the future:

1. Does tumor cell ablation release specific tumor cell death signal?

2. How can freezing produce the best ratio of necrosis and apoptosis?

3. Are the cytokines released after freezing derived from tumor microenvironment or natural immune response, and what is their time sequence?

4. Will the functional essence and time sequence of antigen presenting cells that absorb necrotic tissue change after cryoablation?

5. What is the effect of cryoablation and absorption of necrotic tissue on the immunosuppressive function of the body? How to reduce the immunosuppression of the body?

Expert introduction

　

Professor Yang Yongping.

Chinese people’s liberation army general hospital No.5 medical center

Director, Department of Hepatology and Medicine, PLA General Hospital

Chief physician, professor, doctoral tutor

Silver Star of Science and Technology of the General Logistics Department, winner of special allowance of the State Council

Chairman of the Professional Committee of Liver Diseases of China Research Hospital Association

Director of China Hepatitis Foundation

Director of China Research Hospital Association

Vice Chairman of Liver Disease Professional Committee of Beijing Branch of Chinese Medical Association

Vice Chairman of Liver Disease Professional Committee of Beijing Society of Integrated Traditional Chinese and Western Medicine

Take the lead in the major special topics of the "Thirteenth Five-Year Plan and Twelfth Five-Year Plan" of the country, the key topics of the "Twelfth Five-Year Plan" of the army and the key topics of the Beijing Municipal Science and Technology Commission in integration of defense and civilian technologies; Won one national science and technology progress award, one first prize of Beijing science and technology progress award and six second prizes of military science and technology progress award.

Finishing/platform review/Professor Yang Yongping

This article is only for medical and health professionals to understand information, and does not represent the views of this platform. This information cannot replace professional medical guidance in any way, nor should it be regarded as medical advice. If the information is used for purposes other than understanding the information, the platform and the author shall not bear the relevant responsibilities.

　　CCTV News:According to the WeChat official account news released by Shanghai, the Shanghai Central Meteorological Observatory issued a blue rainstorm warning signal at 12: 30 on August 23rd, 2023: Due to the influence of strong precipitation clouds, it is predicted that there will be precipitation in parts of central and southern Shanghai with a cumulative rainfall of more than 50 mm in six hours before midnight today. Please pay attention to the prevention of urban waterlogging caused by heavy rainfall, and do a good job in drainage and waterlogging prevention in low-lying and flood-prone areas.

　　The yellow warning of lightning issued before is still high.

　　Defense guide:

　　1. Stop carrying out outdoor activities in open places.

　　2. Stop swimming in rivers, lakes and seas.

　　3. Stay away from trees, corners or places with prominent metal objects; Don’t hold objects with sharp metal corners in your hands or carry them on your shoulders.

　　Defense guide:

　　1. Citizens should prepare rain gear to ensure safety.

　　2, drivers pay attention to the road water.

　　Level Ⅳ response of flood prevention platform

　　According to the introduction of the Municipal Flood Control Office, the level IV (level IV) response of the city’s flood control stations started simultaneously.

　　Level 4 (IV) emergency response (blue)

Original Zhu Xinpu Yun Dan Gongbu Zhu Xinpu Stroke Prevention Science Popularization

Sudden cardiac death (SCD) is an unpredictable natural death caused by heart, accounting for about 80% of sudden death. The main manifestations are acute onset, with more males than females. A variety of heart diseases can lead to sudden death, especially those with organic basic cardiovascular diseases or related risk factors. Patients may have a history of heart disease or heart disease in the past. At present, it is recognized that most of the deaths within one hour of onset are sudden cardiac death.

According to the China Cardiovascular Disease Report released in 2019, there are 544,000 cases of sudden cardiac death in China every year.

1. Coronary artery disease

It mainly includes coronary heart disease (coronary atherosclerotic heart disease), acute myocardial infarction, coronary thrombosis, embolism or spasm, coronary arteritis, congenital coronary artery dysplasia, etc., among which coronary heart disease is the most common.

As the most common cause of sudden death, coronary heart disease is seen in acute coronary syndrome (including acute myocardial infarction and unstable angina pectoris). According to the American Heart Association, 25% of patients with coronary heart disease take sudden cardiac death as the first clinical manifestation. According to the domestic literature, 80% of adult deaths from sudden cardiac death are related to acute coronary syndrome. These patients died of acute myocardial ischemia.

The etiological basis of coronary heart disease is atherosclerosis, which leads to the decrease of coronary blood flow and myocardial perfusion. Under the inducement, acute coronary spasm or microcirculation embolism can occur, causing acute myocardial ischemia, causing electrophysiological disorder, leading to malignant arrhythmia and even sudden cardiac death.

2.cardiomyopathy

Hypertrophic cardiomyopathy is the most common cause of sudden cardiac death in cardiomyopathy. Hypertrophic cardiomyopathy (HCM) is a complex hereditary cardiomyopathy characterized by thickening of left ventricular wall, which has various clinical and genetic manifestations. It is a common cause of sudden death in adolescents, with a high missed diagnosis rate and 50% family history.

The research shows that the risk of sudden cardiac death such as having a history of ventricular tachycardia attack, severe left ventricular wall hypertrophy (≥30mm), unexplained syncope, family history of sudden cardiac death and exercise-related hypotension is obviously increased. It is suggested that all patients with family history of sudden death should be screened by echocardiography.

3. valvular disease

Cardiac valvular disease is also one of the risk factors of sudden cardiac death, including mitral stenosis and/or insufficiency, aortic stenosis and/or insufficiency, infective endocarditis, mitral valve prolapse (MVP) or chordae tendineae rupture. For example, severe aortic stenosis can cause a serious decrease in blood flow into the aorta and cardiac output, leading to sudden cardiac death.

In China, the incidence of valvular heart disease is high, which is mainly caused by rheumatic diseases, trauma, degeneration, congenital malformation, inflammation and other reasons. The structural function of one or more valves is abnormal, resulting in stenosis and/or insufficiency of the valve orifice.

4. Structural heart disease

Structural heart disease is a general term for a large class of diseases caused by abnormal heart structure, which mainly includes: congenital heart structure abnormality, valve abnormality, coronary artery dysplasia, acquired valve disease and so on.

Congenital cardiovascular diseases mainly include atrial septal defect, ventricular septal defect, patent ductus arteriosus, coarctation of aorta, congenital aortic or pulmonary valve stenosis, tetralogy of Fallot and so on. Such diseases increase the risk of sudden cardiac death. In particular, patients with left-to-right shunt congenital heart disease who develop to Eisenmenger syndrome and complex congenital heart disease are more prone to sudden cardiac death.

Abnormal coronary artery is the main cause of sudden death in young people. Especially after strenuous exercise. The clinical manifestations are angina pectoris, arrhythmia, syncope and even sudden cardiac death after strenuous exercise. Therefore, for special people who have uncomfortable symptoms after exercise, athletes and so on, congenital coronary artery dysplasia should be screened out.

5. Aortic disease

Aortic disease is one of the important factors leading to sudden cardiac death, and its main pathogenesis is fatal ischemia of target organs caused by aortic rupture and involvement of important branches. Among them, Stanford A aortic dissection is the most dangerous, and the main causes of sudden cardiac death include: aortic rupture, pericardial tamponade, dissection involving coronary artery leading to large-scale myocardial infarction, and involvement of brachiocephalic artery leading to cerebral infarction.

6. Pulmonary embolism

Pulmonary thromboembolism is a common emergency in cardio-pulmonary vascular diseases, and its incidence and mortality are extremely high.

The embolus source of pulmonary embolism can be endogenous or exogenous, and the embolic site is mainly in the trunk or main branch of pulmonary artery. Clinically, pulmonary embolism thrombus mainly comes from venous system or right atrial appendage. When patients have pulmonary embolism, pulmonary circulation disorder can occur in a short time, and sudden cardiac death can occur in severe cases.

In daily life, sudden cardiac death caused by pulmonary embolism is most common in "economy class syndrome", that is, the lower limbs are in a state of braking for a long time, which leads to venous thrombosis. Once a large thrombus falls off, it will lead to acute pulmonary embolism, and then sudden cardiac death can occur.

In addition, a considerable number of patients’ thrombi come from the right atrial appendage, mainly due to atrial fibrillation, so for such patients, it is also necessary to be alert to the occurrence of sudden cardiac death caused by pulmonary embolism.

7. Abnormal cardiac electrophysiological activity

Abnormal primary ECG or abnormal ion channels can induce sudden cardiac death, such as sinoatrial node lesions and abnormal cardiac conduction system (Lenegre disease or Lev disease, WPW syndrome, Q-T interval extension syndrome). This is an important cause of sudden death of teenagers.

Once the cardiac electrophysiological abnormality occurs, it may induce cardiac pacing conduction disorder, eventually leading to complete atrioventricular block, and even fatal arrhythmia such as ventricular tachycardia and ventricular fibrillation may occur, which may lead to insufficient blood output from the heart to brain tissue and the whole body, resulting in shock and syncope. If cardiac arrest lasts for 5 minutes, it can cause irreversible brain tissue damage and death, which will eventually lead to sudden cardiac death.

Sometimes, viral infection and other diseases may also involve the cardiac electrical conduction system, which increases the risk of sudden death of patients.

8. Explosive myocarditis

Early mortality is extremely high, which is another important cause of sudden cardiac death in children and young adults. The early symptoms of myocarditis are very similar to the common cold, only "a little uncomfortable", which is difficult to attract attention.

9. Kawasaki disease

The etiology is not clear yet. At present, it is considered that some patients are immune-mediated systemic vasculitis triggered by various infectious pathogens (viruses, bacteria, etc.). Kawasaki disease mostly occurs in children, which is one of the main causes of sudden death of children. Having Kawasaki disease in childhood can also cause myocardial infarction in adults.

10. Others

Other causes of sudden cardiac death mainly include: acute pericardial tamponade, intracardiac thrombosis, electrolyte disorder, sleep apnea and gene correlation.

Original title: How much do you know about sudden cardiac death? 》

Read the original text

According to CCTV news, according to a report by the Japan Broadcasting Association on March 27th, local time, the Japanese Ministry of Health, Labor and Welfare announced the second death case suspected of taking a health product containing monascus from Kobayashi Pharmaceutical Company on March 26th, and the number of people admitted to the hospital has increased to 106.

Earlier, the Japanese Ministry of Health, Labor and Welfare had investigated Kobayashi Pharmaceutical Company and found that there was a new death report in addition to a previously announced death case.

Based on the Food Hygiene Law, Japan’s Ministry of Health, Labor and Welfare has asked Osaka headquarters where Kobayashi Pharmaceutical Company is located to take measures including product abandonment.

In view of the fact that many people were hospitalized and two people died after taking products containing monascus from Kobayashi Pharmaceutical Company, the Japanese Ministry of Health, Labor and Welfare will hold a meeting with the Consumer Department, the Ministry of Agriculture, Forestry and Fisheries and other relevant departments on the 27th to discuss future countermeasures.

According to Japanese media reports on the 27th, the Osaka municipal government of Japan ordered Kobayashi Pharmaceutical Company to recall three products, including "red yeast cholesterol granules".

Consumers die after taking health care products.

Kobayashi Pharmaceutical Emergency Recall

Previously, Kobayashi Pharmaceutical Co., Ltd. said that a consumer who took the company’s health care products containing monascus ingredients died of kidney disease. Some consumers suffer from diseases in kidney and other parts after using this health care product, and they are hospitalized, and some even need dialysis.

On March 26, Kobayashi Pharmaceutical updated the notice asking consumers to stop using the company’s products containing monascus ingredients and to recall them independently. According to the notice, the consumer took the company’s health care product containing monascus ingredients-monascus cholesterol granules. However, the notice did not disclose the relevant information of the consumer and the time of death.

The notice said that it has been confirmed that the consumer continued to buy red yeast cholesterol granules from April 2021 to February 2024. The company is investigating whether there is a causal relationship between the consumer’s death and taking the above health care products.

According to Kyodo News, since February 2021, monascus cholesterol granules have been sold in e-commerce channels and stores, and about 1.06 million bags have been sold by the end of February this year.

Three products involved
Are health care products for improving cholesterol.

The following is a list of three recalled products released by Kobayashi Pharmaceutical Company official website, all of which are health products for improving cholesterol. Please be careful not to buy or continue taking it.

China e-commerce platform removes products involved.

Consumers can return goods and get a refund.

Kobayashi Pharmaceutical Co., Ltd. is an old Japanese pharmaceutical company with a history of more than 100 years, and many of its products are quite popular. According to the company, monascus is a raw material produced by mixing monascus with steamed rice for fermentation. The company publicizes that this ingredient is expected to reduce the cholesterol value of low density lipoprotein.

The reporter searched a number of domestic e-commerce platforms and found that there are currently no three related products sold on the official e-commerce platform of Xiaolin Pharmaceutical, but there are still purchasing merchants selling related recalled products.

Kobayashi Pharmaceutical China Company said, "The company has received reports that it may cause kidney diseases and other problems after eating, and some of its products are sold to China through cross-border channels. If a consumer has eaten it and feels unwell, contact customer service, and the products that have not been eaten will be returned and refunded. "

On March 22nd, @ Kobayashi Pharmaceuticals issued a notice to remind consumers who have red herring cholesterol granules (60, barcode 4987072059708) to stop eating.

Up to now, the products involved have been removed from the official store of Kobayashi Pharmaceutical, the e-commerce platform mentioned in the notice. According to the reporter’s inquiry, multiple e-commerce platforms have been unable to search for this product.

Kobayashi pharmaceutical president bowed and apologized.

Admit that decision-making is slow

On the evening of March 22nd, President Kobayashi held a press conference and bowed to apologize for this issue.

According to Japanese media reports, the analysis results on the 16th of this month showed that some raw materials of monascus may contain unknown ingredients, but the company did not announce the recall until the 22nd. In this regard, the president of Kobayashi Pharmaceutical admitted that the decision was slow.

Another five Japanese companies issued a recall announcement.

Among the 18.5 tons of monascus raw materials produced by Kobayashi Pharmaceutical in 2023, about 16 tons of raw materials were sold to other companies for brewing and food manufacturing, except for their own health care products. At present, Kobayashi Pharmaceutical has issued a recall request to all 52 enterprises that purchased its monascus raw materials through its sales company. Affected by this, some food, brewing and other enterprises that use Xiaolin Pharmaceutical’s red yeast raw materials have also announced the recall of related products.

It is understood that the company is working hard to confirm the sales partners and recalls, and it is expected that the recall scale will be further expanded.

The reporter’s investigation found that at present, five Japanese companies have issued relevant recall announcements and announced related products. The names of the five enterprises are respectively Baojiuzao Co., Ltd., ZERO PLUS Co., Ltd., Doufu Co., Ltd. Nagoya Store, Takeya Co., Ltd. and Jiwen Food Co., Ltd.

Baojiuzao Co., Ltd.

On March 24th, Japan Baojiu Brewery Co., Ltd. announced that it had decided to recycle about 96,000 bottles of this product by itself because a wine produced by this company used red yeast raw materials provided by Kobayashi Pharmaceutical Company. At present, there are no reports of health damage related to this product of Baojiu Brewery Company.

According to the wine manufacturer, this wine has only been exported to Singapore and Taiwan, China, and has not entered the Chinese mainland market.

ZERO PLUS co., ltd

Japan’s ZERO PLUS Company issued a recall notice on March 22nd, saying that there may be unknown ingredients in the raw materials of red yeast in the thick cheese biscuits sold by its KUMITE brand. At present, the specific information of this ingredient cannot be determined. In order to prevent the safety problem from further expanding, it will be recycled independently from now on.

Doufu corporation company Nagoya branch

The recall announcement issued by the Nagoya Pastry Store of Doufu Co., Ltd. said that because its eight products contain red rice malt ingredients produced by Kobayashi Pharmaceutical, there are potential health risks, so they will take the initiative to recall these products and suspend sales.

Takeya corporation

On March 25th, Takeya, a Japanese miso production company, issued a notice that the product "Low-salt Monascus Miso" used the raw materials of Monascus produced by Kobayashi Pharmaceutical, and the sales of this product will be stopped from now on and recycled independently.

Jiwen food co., ltd

Japan’s Jiwen Food Company issued a notice on March 24th, stating that the products "domestic squid pickled products" and "squid pickled products" used the raw materials of red koji produced by Kobayashi Pharmaceutical, so they were recycled independently from now on. If the products are sent to the address designated by the company, the company will refund the payment in the future.

Xiaolin Pharmaceutical’s market value evaporated by over 4.2 billion yuan.

It is reported that Kobayashi Pharmaceutical (China) Co., Ltd. is a wholly-owned subsidiary of Kobayashi Pharmaceutical Co., Ltd.

According to the national enterprise credit information publicity system, Kobayashi Pharmaceutical (China) Co., Ltd. was established in Shanghai on April 9, 2018 with a registered capital of US$ 77,982,400. The legal representative is Matsushita Tuoye, and the company is 100% owned by Kobayashi Pharmaceutical Co., Ltd.

As of the morning of 27th, the share price of Kobayashi Pharmaceutical Co., Ltd. fell by 3.53%, with a total market value of 381.7 billion yen. Since the fermentation of the event, Kobayashi Pharmaceutical has fallen by nearly 20%, and its total market value has evaporated by more than 90 billion yen (about RMB 4.29 billion) compared with the closing on March 22.

Netizen: I didn’t expect health care products to be fatal.

In response to this matter, some netizens said that it was "terrible", "too scary" and "I didn’t expect health care products to be deadly", and some netizens were worried about whether other products such as warm babies and antipyretic stickers of this brand could still be used.

(Yangcheng Evening News Yangcheng School Comprehensive CCTV News, Beijing Daily, Xinhua News Agency, China News Network, Zhongxin Jingwei, Overseas Network, Beijing Youth Daily, User Comments)

Original title: Health care products are still dying? 2 deaths and 106 people have been hospitalized! Kobayashi Pharmaceutical urgently recalled, and these products should also be noted →　

　　[Bourne ultimatum] It’s another weekend in a blink of an eye, and the new issue of Bourne ultimatum meets with you. There are many heavy models in this week’s spy photos. Domestically, there are two new cars, the new RAV4, the production version, and the speed car, and the domestic L; Overseas, there are brand-new Q5, brand-new, brand-new and brand-new G-class Toyota. Next, let’s walk into the text and see the specific situation of these 9 cars.

● Zotye Damai X7

　　All along, we can find the shadow of existing models of overseas brands in many models of Zotye. However, when faced with the BMW X7, many people may be confused, but don’t rush to deny their knowledge reserves, because this car is not a production model, but a GTE. Obviously, Zotye beat us to it.

　　Damai X7 has a high degree of restoration for the appearance of Cross GTE concept car, including the front face layout and tail shape. On the side, the lines of the Damai X7 are straighter, which is not as exaggerated as the Cross Coupe GTE concept car.

　　In the interior part, Damai X7 still draws lessons from the design of the Cross Coupe GTE concept car, and even the details of the air conditioning outlet, buttons and chrome-plated decorative parts are exactly the same as the Cross Coupe GTE concept car. However, the shift lever of the manual transmission model has no sense of design, which is not very harmonious with the overall design.

　　As for the power system, Damai X7 will provide three power options, namely 1.5T, 1.8T and 2.0T. In terms of transmission system, it is matched with 5-speed manual or 6-speed.

　　Editor’s comment:Every time Zotye launches a new car, it will become the focus of consumers’ attention, because there is really no manufacturer in the market that can reverse develop overseas car companies on a large scale like Zotye. From the earliest, to the next, Zotye’s imitation road has embarked on the "first cosmic speed". What drives Zotye to go on like this is not only high attention, low research and development cost, but also good market response. For example, the monthly sales of Zotye are often above 10,000 vehicles, and in the first five months of 2016, it also sold 43,284 vehicles.

　　Although many people will show disdain for such a product, the sales data reflect that it still has a large market. This shows that Zotye’s ability to grasp consumer demand and market hotspots is still very good. This time, the concept car that Volkswagen has not yet mass-produced is used as a blueprint to imitate, and Zotye has even walked in front of the public. Since I have such a vision, I still hope Zotye can bring us more original designs, which is really ahead of other brands.

　　Read more:

　　Two Interior Styles Zotye Damai X7 Latest Real Car Map Exposure

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● FAW Toyota new RAV4

　　The market has always been one of the main battlefields among the major players. Although it is an old player, the sales performance of RAV4 has no advantage over competitors. The reason is that the configuration is one aspect that many consumers are dissatisfied with, so the new RAV4 came into being, and the new car was upgraded in the configuration part, further enhancing its competitiveness.

　　The new RAV4 continues the design of overseas models in appearance. The main change lies in the front face, the air intake grille above becomes very long and narrow, and the modeling details of the front bumper below are also adjusted. At the rear, the new car redesigned the details of the taillights and bumpers.

　　In the interior, we can see that the overall design of the new car has not changed, but some models have added a 7-inch central control LCD screen and a dashboard with a 4.2-inch LCD screen. In the configuration part, automatic start-stop and body stability systems, systems and systems are added to the entry-level models. The configuration of other models has also been improved to varying degrees, which will increase functions such as panoramic image system, outdoor (with heating), keyless entry (one-button start), and uphill assistance. On the whole, the new RAV4 has a significant improvement in configuration.

"3ZR-FAE engine for overseas models"

　　In terms of power, the new RAV4 is still equipped with 2.0L and 2.5L engines, of which the 2.0L engine is a new engine code-named 3ZR-FAE, and its maximum horsepower is increased from 147 HP to 150 HP. Due to the continuous lift technology, its fuel consumption performance is worth looking forward to.

　　Editor’s comment:For consumers who are concerned about RAV4, the upgrade of this configuration should be the most attractive. The current models are not equipped with traction control and body stability control system as standard, which makes some consumers finally choose other products. The new models have been improved in these aspects, and are fully equipped with body stability system, traction control system and uphill auxiliary system, and other configurations have also been upgraded. FAW Toyota has made positive adjustments to the feedback from the market, which is very worthy of recognition.

　　In addition to the configuration, we need to pay attention to the replacement of a new 2.0L engine. Although the new engine has little improvement in power performance, according to the introduction of Toyota manufacturers, the continuous variable lift technology can reduce fuel consumption by 5-10%. For RAV4, which is biased towards home, low fuel consumption is undoubtedly an attractive selling point, which is worth looking forward to. It is expected that the price of the new car will not change much, and it may still remain in the range of 180,000-270,000 yuan.

　　Read more:

　　Or the new RAV4 configuration will be exposed on July 28th.

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● Concept B production version

　　As an evergreen tree in the China brand SUV market, Haval’s every move will attract the attention of many consumers, and so will this production version of Concept B. Concept B is a production version, focusing on young and fashionable consumer groups.

　　The production version of Harvard Concept B locates a small SUV, which will be sold at the same time as H2 in the future. In terms of appearance, this car adopts a typical blue standard style, such as hexagonal air intake grille and sharp headlights, which is very similar to other blue standard models.

　　On the side, this car largely retains the design of the concept car. The waistline rises backwards, creating a running posture. At the rear, the Concept B concept car uses two exhaust ports on both sides. Referring to the car body parameters of the concept car, the length, width and height of the car body of Concept B are 4146/1772/1623mm and 2550mm respectively, which is slightly smaller.

　　The interior of the production version of Concept B is also quite individual. The center console is equipped with a large-size LCD screen, and the layout style of buttons at the bottom of the screen is the same as that of the blue standard H2. On the right side of the center console, chrome-plated decorative pieces are integrated with the air-conditioning outlets on both sides, which is very novel. In terms of configuration, the new car is equipped with functions such as reversing radar, keyless entry and one-button start. At present, the power information of the car has not been exposed.

　　Editor’s comment:In terms of body size, the production version of Haval Concept B is a small SUV between Haval H1 and H2. It is closer to the Haval H2 blue standard in terms of body size and design, and it is also likely to be equipped with a 1.5T engine in terms of power. In terms of price, the current price of Haval H1 is 54,900-82,900 yuan, and the price of Haval H2 is 88,800-12,800 yuan, of which Haval H1 focuses on the market of about 70,000 yuan, and Haval H2 focuses on the market of about 100,000-110,000 yuan. Therefore, in the market of 800,000-100,000 yuan, Harvard still has potential to be tapped, and Concept B was born for this purpose. It is estimated that the final price of this car will be around 700,000-110,000 yuan.

　　Although it is said that having more children is easy to fight, it does not mean that children will not fight. At the same time, three products are laid out in the small SUV market, which is rare in car companies. To handle the relationship between these cars well, we must do a good job in vehicle positioning, configuration level, pricing and market strategy, so that the three can be in their respective positions and form a joint force, which will be a difficult problem before Harvard. In addition, I have a question. Since this car is positioned between H1 and H2, how will it be named? Haval H1.5?

　　Read more:

　　Provide manual transmission Haval Concept B production spy photos.

The new semester has arrived, and friends should start studying hard! In English learning, many grammatical problems will become a problem. Xiaobian will publish some articles about English spelling, punctuation, grammar, vocabulary description and writing tips one after another this semester, hoping to help English learning.

There are several differences in spelling between British English and American English. These differences are often due to the fact that British English often retains the spelling of the source language, such as French, while American English adjusts the spelling in order to correctly reflect the actual pronunciation of words.

If you want to write something for the British, you should only use British spelling. In a few cases, American spelling is also acceptable in British English, especially words ending in -ize/-ization. In this case, -ise/-isation or -ize/ization can be used in British English, but it is important to be consistent in an article and use one spelling from beginning to end.

Today, we list several major spelling differences and compare the spelling differences between British and American English.

1) Words ending in–re: English ends in–re; American style ends with -er.

2) Words ending in -our: English ends in -our; American usually ends with -or.

3) Words ending in -ize or -ise: In British English, verbs spelled with -ize or -ise are acceptable; In American English, it is always spelled -ize.

4) Words ending in -yse: In British English, this kind of verb is written as-yse; American English is always writing -yze.

5) Words ending in vowel+letter L: In British spelling, when a verb ends in vowel+letter L, if you need to add vowel, you will double write L; In American spelling, there is no need for double writing.

6) diphthongs’s spelling: In British English, diphthongs ae or oe are both two letters; In American English, they are all written as a letter e.

Tip: In American English, some specific words, such as archaeology, still retain the spelling of ae. This is the standard spelling method, and if it is only written as e, it is archeology, which is usually acceptable.

7) Nouns ending in -ence: nouns ending in -ence in British English are written as -ense in American English.

8) Nouns ending in–OGUE: English spelling is–OGUE; American spelling can be -og or -ogue.

This difference is not difficult to grasp. In American English, the writing of analogue is acceptable, but not universal; The spelling of catalog has become the standard form in the United States, and the writing of catalog is not uncommon; Dialogue is still more popular than dialogue.

Welcome to pay attention to WeChat WeChat official account: OxfordDictionaries and Weibo: @ Oxford Dictionaries Weibo.

(Source: Oxford Dictionary Editor: Julie)

The business review of the Board of Directors of Tuojing Technology in 2022 is as follows:

　　I. Description of the industry and main business of the company during the reporting period.

(a) the company’s industry

1. Industry and determination basis

The company is mainly engaged in R&D, production, sales and technical services of high-end semiconductor special equipment. According to the Guidelines for Industry Classification of Listed Companies (revised in 2012) issued by CSRC, the company belongs to the special equipment manufacturing industry (industry code: C35). According to the National Economic Industry Classification (GB/T4754-2017), the company belongs to the special equipment manufacturing of semiconductor devices under the special equipment manufacturing industry (industry code: C3562). According to the Classification of Strategic Emerging Industries (2018) issued by the National Bureau of Statistics, the company belongs to the integrated circuit manufacturing industry under the new generation of information technology industry.

2. Semiconductor equipment industry

The development level of semiconductor industry is closely related to the national science and technology level, and its development has become the vane of economic and social development in all countries around the world, and it is an important symbol to measure the modernization degree and scientific and technological strength of a country. As the technical leader of the semiconductor industry chain, semiconductor equipment is the foundation of the development of the semiconductor industry and the key to technological progress, and its self-control is particularly important. With the iterative upgrading of semiconductor technology, semiconductor components are gradually developing towards precision and miniaturization, which constantly challenges the manufacturing technology and makes the important position of semiconductor equipment increasingly prominent.

In recent years, driven by the rapid downstream development, the semiconductor equipment industry has maintained rapid growth. According to SEMI statistics, the global sales of semiconductor manufacturing equipment in 2021 was about USD 102.6 billion, up by 44% year-on-year. In 2021, the sales scale of semiconductor equipment in Chinese mainland reached USD 29.62 billion, up by 58% year-on-year. Chinese mainland was the largest market of semiconductor equipment in the world in 2020 and 2021. In the first quarter of 2022, the global shipment amount of semiconductor equipment reached US$ 24.7 billion, up 5% year-on-year. In the first quarter of 2022, the shipment amount of semiconductor equipment in Chinese mainland ranked first, up 27% year-on-year.

At present, the global semiconductor equipment market is mainly dominated by foreign manufacturers. With China’s continuous policy support and increased investment in the semiconductor industry, domestic semiconductor equipment has achieved a qualitative leap from scratch and from weak to strong, which has continuously improved the ecology and manufacturing system of China’s semiconductor industry. However, China’s semiconductor equipment market is still heavily dependent on imports. Therefore, the domestic semiconductor equipment manufacturers who can achieve import substitution have a large market space and have a huge growth opportunity.

3. Development of the film deposition equipment industry where the company is located.

(1) Market scale of thin film deposition equipment

According to the data of SEMI and Beijing Oulixin, the global market scale of thin film deposition equipment will reach 21 billion US dollars in 2021. According to the proportion of domestic semiconductor equipment market accounting for 28.87% of the global market in 2021, the market scale of thin film deposition equipment in Chinese mainland will be about 6 billion US dollars in 2021, which is about 33% higher than the estimated 4.5 billion US dollars in 2020. In 2022, the global market scale of thin film deposition equipment will continue to grow, which is expected to reach $25 billion, and the Chinese mainland market will also maintain the growth trend, bringing broad market space for domestic thin film equipment manufacturers.

According to SEMI statistics, in the equipment investment of newly-built fabs, the investment in equipment related to wafer manufacturing accounts for about 80% of the total equipment investment. As one of the three major equipment in wafer manufacturing, the investment scale of thin film deposition equipment accounts for 25% of the total investment in wafer manufacturing equipment.

Proportion of investment in semiconductor equipment

(2) Market situation of thin film deposition equipment segments focused by the company.

Thin film deposition equipment mainly includes chemical vapor deposition (CVD) equipment and physical vapor deposition (PVD) equipment. The company mainly focuses on plasma enhanced chemical vapor deposition (PECVD) equipment, sub-atmospheric chemical vapor deposition (SACVD) equipment and atomic layer deposition (ALD) equipment in the field of CVD equipment subdivision. Different kinds of thin film deposition equipment are suitable for different requirements of different process nodes on film quality, thickness and pore groove filling ability.

According to the data of SEMI and Beijing Oulixin, in 2021, PECVD is the highest equipment type among all kinds of thin film deposition equipment in the world, accounting for 33% of the total thin film deposition equipment market, ALD equipment accounts for about 11%, and SACVD belongs to other thin film deposition equipment categories, accounting for less than 6%.

Proportion of all kinds of thin film deposition equipment

(3) Development trend of thin film deposition equipment

① The market demand for thin film deposition equipment is growing steadily.

With the improvement of the overall prosperity of the semiconductor industry, the global semiconductor equipment market shows a rapid growth trend, which drives the market demand for thin film deposition equipment to increase. Maximize Market Research predicts that the global market size of semiconductor thin film deposition equipment will reach 34 billion US dollars in 2025, with a compound annual growth rate of 13.3% from 2020 to 2025. Among them, the market scale of ALD equipment will grow rapidly. According to the market research organization Acumen research and condulting, with the increase in the number of advanced semiconductor manufacturing lines, the global ALD equipment market will reach about 3.2 billion US dollars in 2026.

In recent years, driven by the strong market demand for semiconductor products, the global fabs have expanded their production capacity and gradually moved to Chinese mainland. Chinese mainland has become the new production center of global fabs. SEMI data shows that in 2021-2022, there were 29 new fabs in the world, including 8 in Chinese mainland, accounting for 27.59%. The expansion and construction of Chinese mainland Wafer Factory has accelerated the development and layout of domestic semiconductor industry, providing a huge market space for the development of domestic semiconductor equipment.

According to the statistics of Jiwei Consulting, Chinese mainland is expected to add 25 12-inch wafer factories in the next five years (2022 -2026), with a total planned monthly production capacity of over 1.6 million wafers. By the end of 2026, the total monthly production capacity of Chinese mainland 12-inch wafer fab will exceed 2.763 million wafers. The upsurge of local fabs in China will lead the demand growth of semiconductor thin film deposition equipment in China.

(2) chip technology progress and complicated structure improve the demand for thin film equipment.

Thin film deposition refers to the deposition of a layer of thin film material to be processed on the silicon wafer substrate. The deposited thin film material can be nonmetal such as silicon dioxide, silicon nitride, polysilicon and metal such as copper. Thin film deposition equipment is mainly responsible for the deposition of dielectric layer and metal layer in each step. PECVD, ALD and SACVD products focused by the company are mainly used to deposit dielectric thin film materials, which are widely used in logic chips, 3D NAND FLASH memory chips and DRAM memory chips.

Application of dielectric thin film in logic chip

Application of Dielectric Thin Film in 3D NAND FLASH Memory Chip

Application of dielectric film in DRAM memory chip

The development of thin film equipment supports the development of integrated circuit manufacturing technology to smaller processes. With the iterative upgrade of integrated circuit chip technology, the wafer manufacturing process is becoming more and more precise, the complexity of chip structure is increasing, the required thin film deposition processes and thin film types are increasing, and the requirements for thin film performance are also increasing. This trend puts forward higher technical requirements for thin film deposition equipment, and the market is increasingly dependent on high-performance thin film equipment.

In 90nm CMOS chip technology, about 40 thin film deposition processes are needed. In the production line of 3nm FinFET process, more than 100 thin film deposition processes are needed, and the number of thin film materials involved has increased from 6 to nearly 20, and the requirements for thin film particles have also increased from micron level to nanometer level, thus driving the wafer factory to increase the demand for thin film deposition equipment.

Comparison of thin film deposition processes at different process nodes

In the field of FLASH memory chips, with the development of mainstream manufacturing technology from 2D NAND to 3D NAND structure, the complexity of the structure leads to the increasing demand for thin film deposition equipment. With the increasing number of stacked layers of 3D NAND FLASH chips, from 32/64 layers to 128/196 layers and more advanced nodes, the demand for thin film deposition equipment will continue.

Although the global semiconductor equipment market has a strong periodicity, Chinese mainland’s semiconductor industry is facing unprecedented development opportunities, with national strategic focus, huge market support, benign interaction of industrial chains, increasing industrial capital, increasing number of fabs invested by mainland and international capital, and more advanced manufacturing processes. China’s thin film deposition equipment industry will maintain high growth, and the importance of China market will be further enhanced in the future.

(2) Description of the main business.

1. Overview of the company’s main business

The company is mainly engaged in research and development, production, sales and technical services of high-end semiconductor special equipment. The company’s main products include plasma enhanced chemical vapor deposition (PECVD) equipment, atomic layer deposition (ALD) equipment and sub-atmospheric chemical vapor deposition (SACVD) equipment, which have been widely used in the production line of 14nm and above process integrated circuits in domestic fabs, breaking the monopoly of international manufacturers on the domestic market in the field of high-end semiconductor thin film deposition equipment and competing directly with international oligarchs. At present, the company is the only manufacturer of integrated circuit PECVD equipment and SACVD equipment for industrial application in China, and also the leading manufacturer of integrated circuit ALD equipment in China.

2. The company’s main products

During the reporting period, the company continued to expand the application fields of PECVD, ALD and SACVD products, continuously enriched and improved the functions of mass-produced products, maintained the core competitiveness of products, further enhanced the market share of existing products, and obtained repeated orders from existing customers and new customers in the fields of logic chips and memory chips. The scale of mass production and application of the company’s products in the wafer manufacturing production line continues to expand. By the end of the reporting period, the cumulative number of products produced by the company’s equipment in the client production line has increased from more than 46 million as of December 2021 to more than 71 million. During the reporting period, the company’s equipment performed well in the production and operation stability of the client production line, and the average Uptime of the machine was over 90% (the industry standard is usually over 85%).

On the basis of existing products, the company has actively deployed new product research and development around the subdivision of CVD equipment, and continuously enriched the company’s product categories. At present, it has developed new products such as TS-300 (polygonal high-yield platform), thermal-atomic layer deposition (Thermal-ALD) based on high-yield platform, high-density plasma enhanced chemical vapor deposition (HDPCVD) equipment and ultraviolet curing (UV Cure) equipment.

The company’s existing PECVD, ALD and SACVD products are as follows:

①PECVD series products

PECVD equipment is one of the core equipment in chip manufacturing. Due to the action of plasma, high-density and high-performance thin films can be formed at relatively low reaction temperature, and the existing thin films and the formed underlying circuits are not damaged, thus achieving faster film deposition speed. It is the most widely used equipment type in the film deposition process of chip manufacturing.

The details of PECVD series products are as follows:

②ALD series products

ALD equipment can achieve excellent step coverage and accurate film thickness control with high aspect ratio and extremely narrow trench opening, and realize the precision control of key dimensions in chip manufacturing process. ALD is one of the essential core equipment in the manufacturing of advanced logic chips, DRAM and 3D NAND with complex structure and accurate film thickness requirements.

The company’s ALD series products are as follows:

③SACVD series products

SACVD equipment is mainly used in trench filling process and is one of the important equipment for integrated circuit manufacturing. In the integrated circuit structure, the depth-to-width ratio of trench holes is increasing, and the SACVD reaction chamber environment has a unique high temperature (400-550℃) and high pressure (30-600Torr) environment, which has a rapid and superior Gap fill ability.

The company’s SACVD series products are as follows:

Note: With the continuous enrichment of the company’s product categories, the company continues to improve the product model naming rules. During the reporting period, the company’s product model name was adjusted by implementing the internal decision-making procedures of the company, and the product model was renamed according to the type of equipment platform and the type of reaction chamber.

3. Main business models

(1) Profit model

The company is mainly engaged in research and development, production, sales and technical services of high-end semiconductor special equipment. The company realizes revenue and profit by selling film deposition equipment to downstream customers and providing spare parts and technical services. During the reporting period, the company’s main business income came from the sales of semiconductor equipment, and other business income mainly came from the sales of spare parts related to equipment.

(2) R&D mode

The company mainly adopts the mode of independent research and development. The company has established an international and professional research and development technical team for semiconductor thin film deposition equipment. The company’s R&D technical team has a reasonable structure, clear division of labor, profound professional knowledge reserves and rich experience in production line verification, which is the cornerstone of the company’s independent R&D capability. Guided by customer demand, technical trends of semiconductor special equipment and national major scientific and technological special goals, the company develops and designs new products and processes, manufactures R&D machines, and debugs performance parameters. After passing the company’s test, it is sent to the customer’s actual production environment for industrialization verification, and the products are formally finalized after verification. In addition, the company will continue to enrich and improve the functions of mass-produced products according to the different process application needs of customers.

(3) Purchasing mode

Company procurement is mainly divided into standard parts procurement and non-standard parts procurement. For the procurement of standard parts, the company directly purchases from market suppliers. Non-standard parts are mainly parts designed by the company according to specific technical requirements in R&D and production. For non-standard parts procurement, the company mainly provides design drawings to suppliers and defines parameter requirements, and suppliers purchase raw materials for processing and customization; For specific parts, the company provides drawings and parameters, and supplies raw materials to suppliers, entrusting suppliers to complete customized processing.

(4) production mode

The company’s products are mainly customized and manufactured according to customers’ differentiated needs and purchasing intentions. The company mainly adopts the production mode of combining inventory production with order production. Inventory-based production means that the company starts production before obtaining the formal order, including the production activities started according to the Demo order or the clear customer purchase intention, which is applicable to the company’s Demo machines and some sales machines. Order-based production refers to the production after the company signs a formal order with the customer, which is suitable for most of the company’s sales machines.

(5) Sales and service mode

During the reporting period, the company’s sales model was direct sales, and customers’ orders were obtained through business negotiations with potential customers and bidding. After years of efforts, the company has formed a relatively stable cooperative relationship with domestic semiconductor industry enterprises.

The company’s sales process generally includes market research and promotion, obtaining customer demand and internal discussion, product quotation, bidding operation and management (if applicable), sales negotiation, contract review, signing and execution of sales orders (or Demo orders), product installation and debugging, contract payment, customer acceptance and after-sales service. After the company’s equipment is shipped to the customer’s designated place, it needs to be installed and debugged on the customer’s production line. Usually, after the customer completes the relevant tests, the equipment is accepted, and the company confirms the income after the customer’s acceptance is completed.

During the reporting period, the company’s main business model has not changed significantly.

Second, the core technology and research and development progress

1. Core technologies and their advanced features and changes during the reporting period.

Since its establishment, the company has been focusing on the research and development of semiconductor thin film deposition equipment, forming a series of core technologies with independent intellectual property rights, and reaching the international advanced level. The company’s core technology is widely used in its main business products, which solves the key problems in semiconductor manufacturing, such as uniformity and consistency of nano-scale thin films, small number of particles on the film surface, rapid film formation and stable and high-speed equipment production capacity. While ensuring the realization of film process performance, it improves the production capacity of customer production lines and reduces the production cost of customer production lines. The company’s core technology and its advanced features are as follows:

During the reporting period, the company’s core technology has not changed significantly.

Awards of national science and technology awards

Identification of "individual champions" of national-level "little giant" enterprises and manufacturing industries

2. R&D achievements obtained during the reporting period

The company has always focused on the research and development of semiconductor thin film deposition equipment. During the reporting period, the company was approved to undertake one major national special project. By the end of the reporting period, the company had undertaken seven major national special projects/projects.

The company has a number of independent intellectual property rights and core technologies. By the end of the reporting period, the company had applied for 502 invention patents, 101 utility model patents, 1 design patent and 21 PCT21 patents. A total of 107 invention patents, 79 utility model patents and 1 design patent were obtained.

On April 15th, 2022, China National Intellectual Property Administration announced the pre-winners of the 23rd China Patent Award, and the company’s patent "Load Chamber and Multi-chamber Processing System Using the Load Chamber" was shortlisted for the China Patent Excellence Award.

List of intellectual property rights acquired during the reporting period

3. R&D investment table

Reasons for significant changes in total R&D investment compared with the previous year

During the reporting period, the company continuously enriched the product categories, expanded the application fields of technology, and continuously increased the investment in R&D. The company invested 118 million yuan in R&D in this period, up 45.66% year-on-year, mainly due to the direct investment in R&D and the increase in the salary of R&D personnel.

Reasons for the great change in the capitalization proportion of R&D investment and its rationality

4. Research projects

5. R&D personnel

6. Other explanations

Second, the discussion and analysis of the business situation

During the reporting period, the company has been deeply involved in the field of high-end semiconductor equipment, focusing on the research and development and industrial application of thin film deposition equipment. Focusing on the national special strategic layout, facing the development of domestic integrated circuit chip manufacturing technology and market demand, the company gives full play to its advantages in R&D team, technical reserve, customer resources and after-sales service, seizes the market opportunity of rapid development of domestic semiconductor industry, persists in driving business development with technology and product innovation, continuously maintains the R&D and investment of new products, new processes and new technologies, enhances the market competitiveness of products, and at the same time, continuously strengthens the operation and management of the company to promote its sustained, steady and rapid development.

1. Main business conditions

During the reporting period, the company’s products continued to maintain their competitive advantage, and benefited from the capacity expansion of downstream fabs and the strong support of national policies for domestic equipment. The company’s product sales increased significantly year-on-year, achieving an operating income of 523,216,900 yuan, an increase of 364.87% over the same period of last year, and the operating income increased significantly; The net profit attributable to shareholders of listed companies was 108,122,700 yuan, and the net profit attributable to shareholders of listed companies after deducting non-recurring gains and losses was 49,150,300 yuan, turning losses into profits compared with the same period of last year, and the profitability continued to increase.

During the reporting period, the company realized the main business income of 516,667,400 yuan, an increase of 392.56% over the same period of last year. The analysis of the company’s main business by product category is as follows:

During the reporting period, the company’s main business income mainly came from the sales income of PECVD equipment, ALD equipment and SACVD equipment, among which PECVD equipment was the most important source of the company’s main business income, while ALD equipment and SACVD equipment realized income compared with the same period.

2. The company’s product development and industrialization progress

During the reporting period, the company continued to maintain a high level of R&D investment, gradually improved the technological innovation capability of existing products, maintained the core competitiveness of products, continuously enriched the types of equipment, and broadened the coverage of film technology products, and made breakthroughs and progress in product industrialization and new product research and development.

(1) Progress of industrialized application of existing products

①PECVD series products

During the reporting period, the company’s PECVD(PF-300T (two-station)) equipment continued to maintain its competitive advantage, the order volume increased steadily, and the market share continued to increase, which has been accepted by existing and new customers. By the end of the reporting period, the company’s PECVD(PF-300T) equipment has been widely used in domestic wafer manufacturing production lines, including 28nm and above logic chips, 3DNANDFLASH, DRAM memory chip manufacturing and other fields.

PECVD(NF-300H (six-station)) equipment introduced by the company has achieved the first industrial application in the field of DRAM memory chip manufacturing, and can deposit ThickTEOS dielectric thin films. The equipment can process up to 18 wafers at a time, with high yield and good performance index, which broadens the application coverage of the company’s process.

②ALD series products

During the reporting period, the verification of the company’s PE-ALD series products in the manufacturing fields of logic chips, 3DNANDFLASH and DRAM memory chips progressed smoothly, and the ALD reaction chamber passed the acceptance of existing customers. At the same time, the company is oriented by customer demand and actively deploys the application and expansion of PE-ALD advanced film technology. By the end of the reporting period, the company’s PE-ALD series products have been industrialized in the field of logic chips, which can deposit SiO2 _ 2 dielectric materials with high temperature, low temperature and high quality.

By the end of the reporting period, the company’s Thermal-ALD(PF-300T (two-station)) equipment has completed product development and obtained customer orders, and has been continuously optimized and improved according to customer index requirements.

③SACVD series products

During the reporting period, the company’s SACVD products continued to expand their application fields, and BPSG and SATEOS thin film processes obtained customer acceptance in the field of 40/28nm logic chip manufacturing. By the end of the reporting period, SACVD products of the company have been widely used in the field of logic chip manufacturing of 12-inch 40/28nm and 8-inch 90nm or above, and have obtained orders from existing and new customers.

(2) Progress of new products

During the reporting period, the company continuously enriched the types of equipment in the field of CVD subdivision, expanded the product coverage, and developed TS-300 (polygonal high-yield platform), Thermal-ALD based on high-yield platform, and high-density plasma enhancement.

Learn new products such as vapor deposition (HDPCVD) equipment and ultraviolet curing treatment (UVCure) equipment, and make breakthroughs and progress. The details are as follows:

①TS-300 (Polygon High-yield Platform)

Based on the existing platform, the company developed and designed the design of hexagonal transmission platform, which can carry up to five reaction chambers (10 reaction stations) at the same time, improve the productivity of thin film deposition equipment, and at the same time, integrate and combine various processes to realize continuous multi-step deposition in vacuum environment. The company’s polygonal high-capacity platform can be equipped with PECVD reaction chamber, ALD reaction chamber and HDPCVD reaction chamber, and has obtained orders from existing and new customers.

②ALD series products

Based on Thermal-ALD(PF-300T (Two-station)) equipment, the company developed Thermal-ALD(TS-300 (Polygonal High-yield Platform)) equipment, which can improve the production capacity, at the same time, integrate and combine various thin film processes, and can deposit various metal compound thin film materials such as Al2O3 and AlN, and has obtained customer orders.

③HDPCVD series products

High-density plasma enhanced chemical vapor deposition (HDPCVD) equipment can deposit and sputter thin films at the same time, so as to fill trenches with the aspect ratio less than 5:1. The films deposited by HDPCVD have higher density and lower impurity content, which is mainly suitable for the field of 130-55nm process logic chip manufacturing. The company has developed HDPCVD(PF-300T (single station)) equipment and HDPCVD(TS-300 (polygonal high-yield platform)) equipment, which can deposit thin films of dielectric materials such as SiO2 _ 2, FSG and PSG. HDPCVD series (PF-300T (single station)) equipment has been shipped to the client for industrial verification. Both of the above two equipments have obtained customer orders.

④UVCure equipment

UVCure equipment is mainly used for ultraviolet curing of thin films, which can effectively improve the efficiency and thermal budget of post-treatment process of thin films, and improve key performance indexes such as stress, granularity and hardness of thin films. The company’s UVCure equipment has been designed and developed, which can be used in complete sets with PECVD equipment to carry out UV curing treatment for PECVDLokII, HTN and other thin film deposition. It has been shipped to the client for industrial verification and obtained customer orders.

3. Supply chain security

The company continuously optimized the supply chain management system and established a multi-dimensional coordination mechanism covering production and inventory management, procurement management and logistics management. The company has always attached great importance to the cultivation of suppliers, continuously improved the supplier support and performance appraisal mechanism, and promoted the continuous improvement of supplier product quality and product performance. Under the background of global supply chain tension and epidemic situation, the company strengthened the depth and scope of cooperation with suppliers, constantly adjusted and optimized the supply chain structure by planning in advance and sharing demand forecast, and adopted a global and multi-source supply strategy. At the same time, according to customer demand and R&D demand, the volume and progress of parts procurement are reasonably planned to ensure the timely and stable supply of key parts. During the reporting period, the company’s upstream supply chain remained generally stable, effectively ensuring the smooth progress of production.

4. Market sales

During the reporting period, the company continued to focus on the thin film deposition market in Chinese mainland, and seized the market opportunities brought by the expansion of domestic downstream wafer manufacturing plants. With the core competitive advantages of the company’s products, the market share and customer recognition continued to increase: (1) the company’s three series of products and new products, PECVD, ALD and SACVD, obtained existing and new customer orders; (2) The verification of the company’s products in the customer’s production line progressed smoothly and achieved good results. The scale of mass production and application in the wafer manufacturing production line continued to expand, and the sales volume of products increased significantly year-on-year; (3) The company continues to maintain in-depth and stable cooperation with downstream customers and continue to provide customized high-performance products, laying a solid foundation for the company’s future business growth.

5. Talent team building

During the reporting period, the company continued to strengthen the construction of talent echelon and expand the scale of personnel according to the needs of business development. In terms of talent introduction, actively attract experienced management and technical talents in the industry, and select outstanding graduates from domestic universities. In terms of personnel training, the company continuously optimizes the training system, gives full play to the performance appraisal and incentive mechanism, and enhances the sense of honor and cohesion of employees; Continue to strengthen close cooperation with universities and implement targeted recruitment linked with factories and schools; Establish a joint training mechanism with domestic universities to train reserve talents directionally, which provides strong support for the construction of the company’s talent team.

6. Operation management

During the reporting period, the company continuously improved the product manufacturing level, optimized the material operation management, and effectively improved the timely rate and qualified rate of assembly and manufacturing. The company continuously strengthens the product quality management system, and maintains a high level of after-sales technical support services to enhance customer satisfaction. The company has an EHS (Environment, Health and Safety) compliance management department to supervise the company’s production and operation to ensure the compliance and safety of the company’s production. The company actively arranges information system technical protection and security management to ensure the company’s network security and data security.

7. The company’s initial public offering and progress in the construction of fundraising projects.

During the reporting period, the company completed the initial public offering and listed on the science and technology innovation board of Shanghai Stock Exchange. This initial public offering issued 31,619,800 shares of RMB common stock (A shares) to the public, with the par value of RMB 1 yuan per share, and the issue price was RMB 71.88 per share. The total amount of funds raised was RMB 2,272,831,200. After deducting the issuance expenses of RMB 145,234,000, The success of the company’s initial public offering provides a strong financial guarantee for the company to expand its production scale and develop new technologies and products.

The Company’s fundraising project "High-end Semiconductor Equipment Expansion Project" is the expansion project of "Semiconductor Film Equipment Industrialization Base (Phase I) Project", and the second phase of clean workshop construction, supporting facilities and production automation management system construction are carried out on the basis of the company’s original semiconductor film equipment R&D and production base. During the reporting period, the second-phase clean workshop was basically completed and put into production, and the layout of production automation management system was carried out at the same time.

The third fundraising project, ALD Equipment R&D and Industrialization Project, relies on the advantages of integrated circuit industrial cluster in the new area and talents in Shanghai, and strives to recruit first-class R&D teams to conquer high-end chip manufacturing thin film deposition equipment. During the reporting period, the company’s R&D and industrialization base construction is progressing smoothly, and ALD products have been developed.

8. Foreign investment

During the reporting period, the Company made the following investments:

(1) Establish a wholly-owned subsidiary in the United States.

During the reporting period, the company set up a wholly-owned subsidiary, Tuojing USA. The establishment of this company is conducive to the company to strengthen supply chain cooperation and investigate the international market. As of the end of the reporting period, Tuojing USA has not actually operated.

(2) Capital increase to Tuojing Shanghai

On June 17, 2022, the company held the 11th meeting of the first board of directors, deliberated and passed the Proposal on Using the raised funds to increase capital to wholly-owned subsidiaries to implement fundraising projects, and agreed that the company would use the raised funds to increase capital to Tuojing Shanghai by 270 million yuan to implement the fundraising project "ALD Equipment R&D and Industrialization Project". After this capital increase, the company will accelerate the research and development and industrialization of ALD equipment, improve the layout of the company’s product line and improve the market competitiveness of the company’s products. On July 20, 2022, the company has paid the capital increase to Tuojing Shanghai. On August 9, 2022, Tuojing Shanghai completed the registration of industrial and commercial changes.

(3) Capital increase to Hengyunchang and equity participation in Hengyunchang

On June 17th, 2022, the company held the 11th meeting of the first board of directors, deliberated and passed the Proposal on Foreign Investment and Participation in Shenzhen Hengyunchang Vacuum Technology Co., Ltd., and agreed that the company would increase its capital to Hengyunchang by RMB 20 million with its own funds, accounting for 35,088% of the total share capital of Hengyunchang after the capital increase. Hengyunchang is mainly engaged in R&D, production and sales of RF power supply for semiconductor equipment, photovoltaic and industrial equipment, and has supplied RF power supply, RF matcher and other products for the company. This capital increase is conducive to the company to improve its industrial layout, which is consistent with the company’s strategic layout, has a synergistic effect with its main business, and can enhance the stability of the company’s upstream supply chain. On July 14th, 2022, the company has paid the capital increase to Hengyunchang. On August 8, 2022, Hengyunchang completed the registration of industrial and commercial changes.

9. Corporate governance

During the reporting period, the Company held a general meeting of shareholders, five meetings of the Board of Directors, one meeting of the Audit Committee of the Board of Directors, one meeting of the Remuneration and Assessment Committee of the Board of Directors and two meetings of the Board of Supervisors.

As a listed company, the company has continuously improved its governance structure in strict accordance with the requirements of the Company Law, the Securities Law, the science and technology innovation board Stock Listing Rules of Shanghai Stock Exchange and the Articles of Association of Tuojing Technology Co., Ltd., so as to improve the scientificity, rationality, compliance and effectiveness of management decisions, improve the level of corporate governance and standardized operation, and lay a good foundation for the realization of the company’s business objectives.

10. Company information disclosure and prevention of insider trading.

The company attaches great importance to the standardized operation of listed companies, information disclosure management and investor relations management. According to the relevant laws, regulations and departmental rules, the company has formulated internal systems for regulating the operation of shareholders’ meeting, board of directors, board of supervisors, information disclosure and investor management, and strictly abided by them. The company earnestly fulfills its obligation of information disclosure to ensure the timeliness, truthfulness, accuracy and completeness of information disclosure; Communicate with investors through investor conference call, fax, e-mail and interactive platform for investor relations, and receive on-site investigation of investors, so as to establish a good interactive relationship.

The company attaches great importance to the prevention of insider trading, and completes the registration management of insider information and the prevention of insider trading. Give warnings and education to directors, supervisors, senior managers and relevant employees of the company on a regular basis to prohibit insider trading, and urge directors, supervisors, senior managers and relevant insiders to strictly fulfill their confidentiality obligations and strictly abide by the regulations on stock trading.

Major changes in the company’s operation during the reporting period, as well as matters that have a significant impact on the company’s operation during the reporting period and are expected to have a significant impact in the future.

Third, possible risks

(A) operational risks

1. The risk that the expansion of the wafer factory is less than expected.

The scale of capacity investment in downstream fabs determines the market space of semiconductor special equipment. The expansion investment of the wafer factory has a certain periodicity. If the investment intensity of the downstream fabs decreases, the company will face a decline in market demand, which will adversely affect the company’s operating performance.

Under the background of localization of semiconductor equipment, the company will continuously strengthen its product market competitiveness, improve the trust of existing customers and continuously expand new customers through continuous research and development; The company will always pay attention to the development stage of the semiconductor industry cycle, coordinate all aspects of the company’s purchase, production and sales according to market conditions, and maintain the coordination between the company’s business activities and the industry cycle; At the same time, the company will always ensure that the cash flow is reasonable and sufficient to avoid the company’s operation in the downturn of the industry.

2. Market competition risk

At present, the company’s competitors are mainly internationally renowned semiconductor equipment manufacturers. Compared with Chinese mainland’s semiconductor special equipment enterprises, the international giants have the first-Mover advantage of clients, and the company’s comprehensive competitiveness is in a weak position and its market share is low. In addition, domestic semiconductor equipment manufacturers may enter each other’s business fields and develop similar products. The company faces double competition from international giants and potential new domestic entrants. If the company cannot effectively cope with the market competition environment, its industry position, market share and operating performance will be adversely affected.

At present, the company is the only manufacturer of integrated circuit PECVD equipment and SACVD equipment for industrial application in China. The company will continue to pay attention to the development of foreign competitors, shorten the technology gap with foreign manufacturers through continuous and effective R&D investment, and at the same time pay close attention to the domestic competition pattern to continuously enhance the core competitiveness of products; The company will always pay attention to the competitive situation of the industry, set the direction of research and development scientifically and reasonably, speed up the progress of research and development, and build a higher barrier to entry into the industry; At the same time, the company will also maintain closer cooperation with customers to achieve common growth with downstream customers.

3. Risk of long product acceptance period

The technical parameters of thin films deposited by thin film deposition equipment directly affect the performance of chips. In production, it is not only necessary to detect the film after it is formed

The performance indexes such as thickness, uniformity, optical coefficient, mechanical stress and granularity need to be completed in the wafer production process and chip sealing.

After installation, the reliability and life cycle of the final chip product are tested to measure whether the thin film deposition equipment finally meets the technical standards.

Therefore, the verification time required by the wafer factory for thin film deposition equipment may be longer than other semiconductor special equipment. If affected by some factors, the acceptance period of the company’s products will be extended, the company’s income confirmation and collection will be delayed, which will increase the company’s financial pressure and affect the company’s financial situation.

With the gradual expansion of the application scale of the company’s integrated circuit manufacturing production line, the company’s product technology is becoming more and more mature, and under the efficient and stable cooperation mechanism with customers, the product verification cycle is gradually shortened. The follow-up company will continue to pay attention to the company’s product acceptance and payment, and ensure the sustained and healthy development of the company’s operations.

4. The loss of technical personnel and the risk that high-end technical personnel cannot be continuously introduced.

Semiconductor equipment is a typical technology-intensive industry. In recent years, the domestic semiconductor special equipment market and wafer manufacturing demand are increasing, the competition for talents in the industry is becoming increasingly fierce, and there is a serious shortage of professional and technical talents. If the company can’t continue to provide better salary and development platform for technical talents and attract high-end technical talents from all over the world, it will face the situation of loss of technical talents and insufficient reserves, which may lead to insufficient innovation ability of the company.

The company provides R&D personnel with competitive salary and benefits in the market, continuously improves the performance evaluation and assessment promotion mechanism, and realizes the long-term common development of employees and the company. During the reporting period, there was no loss of core technicians, which ensured the stability of the core R&D team.

5. Risk of technological innovation

With the development and iteration of technology in semiconductor industry, the demand of downstream customers for thin film deposition equipment and performance also changes. Therefore, the company needs to maintain a high R&D investment and maintain the core competitiveness and advanced level of its products. If the company fails to accurately understand the requirements of downstream customers’ production line equipment and process technology evolution in the future, or the technological innovation products cannot meet the needs of customers, it may lead to the company’s equipment failing to meet the manufacturing needs of downstream production lines, which may adversely affect the company’s operating performance.

The company has established a scientific R&D system, with technical innovation closely following the market demand, and the R&D project is guided by customer demand, and always keeps continuous and effective communication with customers, so as to avoid possible losses caused by technical R&D failure.

(B) Financial risks

1. Risk of changes in government subsidy policies

During the reporting period, the government subsidies received by the company mainly supported the company’s R&D investment. In the future, if the government departments’ policy support for the company’s industry is weakened, or other subsidy policies are adversely changed, the amount of government subsidies obtained by the company will be reduced, and the company will need to invest more self-raised funds for research and development, which will affect the company’s cash flow. In addition, the reduction of government subsidies will also have a certain adverse impact on the company’s operating performance.

The company will continue to expand its business scale and improve its profitability, so as to gradually reduce its dependence on government subsidies.

2. The risk of unsustainable profitability

During the reporting period, the company’s net profit attributable to shareholders of listed companies was 108,122,700 yuan, and the net profit attributable to shareholders of listed companies after deducting non-recurring gains and losses was 49,150,300 yuan, turning losses into profits compared with the same period of last year. However, the company needs to maintain a large amount of investment in future R&D activities. If the progress of the company’s R&D projects or the sales of major products are less than expected, the company may have a performance that is less than expected, and there is a risk of unsustainable profitability.

Guided by market demand, the company will continue to enrich its product categories, optimize its product structure, enhance its core competitiveness, and continuously expand its market scale, so as to ensure its operating performance and enhance its profitability.

(C) Macro-environmental risks

1. The risk of increasing international trade friction affecting the safety of the company’s supply chain

In recent years, international trade friction has been constant, and Sino-US trade friction has aggravated the instability of global supply chain. At present, some parts of the company still need to be purchased from foreign suppliers. If the international trade friction intensifies further, the above-mentioned foreign suppliers may be affected by relevant policies to reduce or stop supplying parts to the company, thus affecting the company’s product production capacity, production schedule and delivery time, and reducing the company’s market competitiveness.

Companies and suppliers actively carry out deeper and broader cooperation, adopt a global and multi-source supply strategy, and build a stable cooperation channel to strengthen their own supply chain security and reduce the risks brought by the instability of the international industrial chain.

2. COVID-19 epidemic risk

At present, the epidemic situation in COVID-19 is still spreading around the world, and China is under great pressure to prevent and control the epidemic situation. If a large-scale epidemic breaks out in the place where the company operates, it will adversely affect the company’s production, sales and delivery. In addition, the spread of the epidemic may affect the healthy development of the upstream and downstream of the industry to a certain extent, which may adversely affect the production and operation of the company’s raw material supply and product transportation.

The company attaches great importance to the prevention and control of epidemic situation, always pays attention to the epidemic situation, and continuously improves the production and operation management mechanism under the situation of normalized epidemic situation. During the reporting period, the COVID-19 epidemic did not have a substantial impact on the company’s business.

Iv. analysis of core competitiveness during the reporting period

(A) analysis of core competitiveness

The company is committed to the research and development and production of world-leading semiconductor thin film equipment, and always insists on independent innovation to continuously provide competitive products for the semiconductor industry and customers. The company has established an innovative management system, and has formed competitive advantages in R&D team, technology accumulation and R&D platform, market expansion and after-sales service, which are embodied as follows:

1. It has rich technical reserves and international advanced core technology advantages.

Since its establishment, the company has adhered to independent innovation, formed a series of original designs and built a perfect intellectual property system. By the end of the reporting period, the company had obtained 187 authorized patents, including 107 invention patents.

The company has successively undertaken seven major national special projects/projects, and has developed PECVD, ALD and SACVD equipment supporting different process models, accumulated a number of core technologies for research and development and industrialization in the field of semiconductor thin film deposition equipment, and built a research and development platform with the ability to extend the development of equipment types and process models.

Facing the actual demand of domestic semiconductor manufacturing industry and the evolution rhythm of production line, the company has reserved advanced dielectric material technology thin film deposition technology below 28nm in the field of logic circuit application, 3DNAND and DRAM dielectric thin film deposition technology in the field of memory chips, and dielectric thin film deposition technology needed in the field of advanced packaging, such as TSV, 2.5D-IC and 3D-IC integration. In the future, the company will insist on high-intensity R&D investment, continuously upgrade and optimize existing equipment and processes, and constantly introduce new technologies and equipment for future development needs.

2. Excellent technical research and development and management team advantages.

The company has built an international and professional research and development and management team of semiconductor thin film deposition equipment technology. The founding team of the company takes returned overseas experts as the core, based on core technology research and development, actively introduces overseas high-level talents and independently trains local scientific research teams.

The company’s international and professional senior management team and the incentive system of full shareholding have attracted a large number of experienced domestic and foreign semiconductor equipment industry experts to join the company and made outstanding contributions in machine design, process design and software design. Since its establishment, the company has cultivated its own local research team. With the successful research and development of many products, the company’s local research team has grown into the backbone of the company’s technology research and development. By the end of the reporting period, the company had 296 R&D personnel, accounting for 43.72% of the company’s total employees. The company’s R&D technical team has a reasonable structure, clear division of labor, profound professional knowledge and rich experience in production line verification, which is the cornerstone of the company’s technical strength and guarantees the market competitiveness of its products. During the reporting period, the company’s core technical team was stable and there were no major adverse changes.

3. Leading position in the industry and rich advantages in customer resources.

With the vision of establishing "the world’s leading thin film equipment company", the company has become a leading enterprise in the domestic semiconductor equipment industry through the accumulation and rapid development in the field of thin film deposition equipment, a semiconductor core equipment subdivision.

The company has formed a relatively stable cooperative relationship with domestic semiconductor industry enterprises. The company’s main products PECVD, ALD and SACVD equipment have been sent to the production lines of major integrated circuit fabs in China in batches. In addition, the company actively pays attention to the international market demand and explores the international market in a timely manner.

4. Stable supply chain and low operating cost advantage.

The company has established a perfect supply chain management system, absorbed and accumulated global supply chain resources, established strategic cooperative relations with key suppliers, and built a stable supply chain structure. Through periodic evaluation and examination of suppliers, suppliers are encouraged to improve product quality, delivery time and cost control, so as to improve the competitiveness of enterprises. Based on collaboration, the company interacts with suppliers in real time to jointly carry out agile collaborative product innovation and maintain a good and stable cooperative relationship.

The company’s main competitors are located in the United States and Japan, and the cost of serving customers in Chinese mainland is high. The company’s R&D and production are mainly located in Chinese mainland, which has a geographical advantage. In terms of product design, the company works closely with suppliers to make products modular and easy to maintain, thus reducing the company’s raw material procurement costs. With the continuous maturity of local suppliers, the company has been given more purchasing options. Therefore, compared with its main competitors, the company has certain advantages in operating costs, and with the continuous improvement of production capacity, the advantage of cost reduction will be more obvious.

5. Provide customized products and efficient after-sales service advantages.

The company’s rapid response ability to the specific process materials and specific manufacturing processes put forward by customers can meet the needs of customized equipment in customer production lines in time. This is extremely important for local customers in China to rapidly expand their production capacity in recent years, thus establishing and consolidating a stable cooperative relationship with customers. The production base of the company’s main customers is located in Chinese mainland. Compared with international competitors, the company’s top management and technical team are closer to the main customers, and can provide efficient and timely technical support and after-sales service to ensure and meet customer needs in time.

　　In the history of contemporary literature in China, there is a saying that "three reds and one creation, the mountains are green and the forests are protected", which refers to eight novels that were created in the 1950s and 1960s and had a great impact on society, namely Red Rock (Luo Guangbin and Yang Yiyan), Red Sun (Wu Qiang), Red Flag Spectrum (Liang Bin), Entrepreneurship History (Liu Qing) and. These novels are different from other classic works born in the same period, such as the novel Fight to Tomorrow (White Blade), Iron Wall (Liu Qing), The Story of the Wind and Cloud (Sun Li), flying tigers (Knowing Xia), Spring and Autumn in a Small Town (Gao Yun Lan), Fighting Youth (Xue Ke) and Wildfire Spring Breeze Fighting the Ancient City.

　　Epic and heroic character are the most striking features of these red literary classics. With a strong sense of epic and a high degree of artistic generalization, they respectively reflect the arduous struggles during the period of new-democratic revolution and socialist revolution and construction from different aspects and angles, and truly show the glorious and arduous course that China people have gone through under the leadership of the Communist Party of China (CPC) in various historical periods, which has profound educational significance and strong inspiration. Therefore, in the history of contemporary literature in China, these works are also called "revolutionary historical novels".

　　The authors of "revolutionary historical novels" are mostly the witnesses of the revolutionary history they tell. Just as Tie Ning, chairman of Chinese Writers Association, summarized the revolutionary career and literary career of Xu Guangyao, the author of Fire in the Plain and Private Zhang Ga, they "did not go to the battlefield for writing, but stood at the crossroads of life and death with the people of China in that era filled with blood and fire". And those difficult and tortuous revolutionary experiences provided them with a steady stream of life energy. "As long as you pick up a pen and let your thoughts go back to that era, you can regain your strength and live and write tenaciously with a hundred times of courage and will. It is in this sense that writing presents its value higher than life. "

　　The red classics have left us many familiar heroes and shining images of Communist party member. Song of Youth is full of youthful elegance and intellectual woman Lin Daojing who bravely pursues democracy and freedom. Jiang Jie, a revolutionary martyr who endured torture, was unyielding, cherished lofty ideals and was not afraid of sacrifice in Red Rock; Liang Shengbao &hellip, an ordinary worker who is hardworking, simple and persevering in the History of Entrepreneurship, insists on starting a business despite hardships; &hellip; These lifelike heroes show us the indomitable and heroic revolutionary spirit of the Chinese nation. With the red classic works deeply rooted in people’s hearts, these outstanding images of communist party member have inspired generations to struggle for communist ideals and beliefs.

　　In addition to the magnificent novels, writers have also left many famous literary works of other genres. Writers such as Sun Li, Ru Zhijuan, Serina Liu, Jun Qing and Wang Yuanjian have incorporated more personal perspectives and personal experiences in their short stories, such as Memories of the Mountain (Sun Li), Lily (Ru Zhijuan), Riverside at Dawn (Jun Qing), Party dues (Wang Yuanjian), Music of Heroes (Serina Liu) and Wan.

　　Poets such as Ai Qing, Li Ji, Li Ying, Cang Kejia, Yan Chen, Zhang Zhimin, Ruan Zhangjing, Guo Xiaochuan, Wen Jie and He Jingzhi joined in the chorus of praise for the Communist Party of China (CPC), China Revolution and New China, such as To the Sun (Ai Qing), To Kunlun (Li Ji), Li Dazhao (Cang Kejia) and Zhanghe Water (Ruan Zhangjing Qing Sha Zhang (Guo Xiaochuan) and Love Song of Turpan (Wen Jie) have all become famous works. It is worth mentioning that He Jingzhi’s Song of Lei Feng has played a special role in praising Lei Feng, an outstanding Communist party member in new China.

　　In terms of prose, reportage and newsletter features, in addition to "Remember a spinning wheel" (Wu Boxiao), "Who is the cutest person" (Wei Wei) and "The example of the county party secretary &mdash; &mdash; Jiao Yulu (Mu Qing, fengjian, Zhou Yuan) and other works, the large-scale series single spark can start a prairie fire and the large-scale series Red Flag Fluttering have also become unforgettable memories for a generation. The former clearly and completely reflects the history of the birth, struggle, growth and development of the People’s Liberation Army, while the latter specifically publicizes the history of the glorious struggle of the people of the Communist Party of China (CPC) and China to young readers, eulogizes the martyrs and heroes in China’s previous revolutionary struggles in the past hundred years, and encourages the younger generation to March bravely into infinitely beautiful socialism.

　　Since the beginning of the new era, the literary creation with red theme has still set off a wave again and again, and has been explored and expanded in the new era background, resulting in Oriental and Red Ribbon on the Earth (Wei Wei), Garland under the Mountain (Li Cunbao), Bright Sword (Dou Liang), Historical Sky (Xu Guixiang) and Liberation War (Wang Shuzeng).

　　(Reporter Rao Xiang)

Jiaojiang release

Recently, Zhejiang Provincial Department of Human Resources and Social Security, Zhejiang Federation of Trade Unions and Zhejiang Provincial Committee of the Communist Youth League jointly issued a document to publish the "List of Personnel of Zhejiang Artisans Training Project in 2023", and 8 people from Jiaojiang District were selected.

Come and see, are there any craftsmen you know?

Wang Yongjun

Wang Yongjun, male, born in June, 1977 in Taizhou, Zhejiang Province, now works in Zhejiang Haizheng Pharmaceutical Co., Ltd., as deputy director of the workshop, chief chemical engineer and engineer, mainly responsible for the production of anti-tumor APIs. Won the honors of Zhejiang craftsman, Zhejiang Golden Blue Collar, the second prize of Zhejiang Workers’ Vocational Skills Competition, the second prize of group, Taizhou craftsman, five-star Taizhou mechanic, Taizhou technical expert, Jiaojiang technical expert, Jiaojiang Wang Yongjun technician studio leader, Jiaojiang model worker craftsman innovation studio leader, etc. Instructed and trained a number of technicians and senior engineers, and achieved excellent results in the vocational skills competitions of chemical general control workers in Zhejiang, Taizhou and Jiaojiang. One person won the Zhejiang Excellence Award, three people won the Taizhou Technical Expert, two people won the Taizhou May 1st Labor Medal and two people won the Jiaojiang Technical Expert.

Zhao erqiang

Zhao Erqiang, male, born in November 1988 in Tianshui, Gansu Province, party member, graduated from College of Medicine and Chemical Engineering of Taizhou University, and is a chemical inspector technician and engineer. Now he works in Zhejiang Haizheng Pharmaceutical Co., Ltd. as QC supervisor, mainly responsible for the process verification and commercial testing of preparation products. He was honored as a representative of the 15th Communist Youth League Congress in Zhejiang Province, a Zhejiang craftsman, a Zhejiang young craftsman, a Taizhou May 1st Labor Medal, a Taizhou skill master, a Taizhou craftsman, a five-star Taizhou mechanic, a practical talent shortage for enterprises in Jiaojiang District, and a Jiaojiang craftsman. Over the past three years, five technicians and ten senior technicians have been trained, many of whom have achieved excellent results in the vocational skills competition of chemical inspectors in Taizhou and Jiaojiang District, one has won the Zhejiang Young Craftsman, two have won the May 1st Labor Medal in Taizhou, and three have won the Taizhou Technical Expert.

Wang zhi

Wang Zhi, male, born in May, 1983 in Taizhou, Zhejiang Province, party member, graduated from Chongqing University. He is a senior engineer, locksmith technician and professional qualification appraiser of the Ministry of Human Resources and Social Security. Now he works for Jack Technology Co., Ltd. as the director of seam development. He was awarded the honors of Zhejiang craftsman, Taizhou craftsman, young scientific and technological talents in sewing machinery industry, Taizhou 211 talents, advanced individual in United front work in Jiaojiang District, young post expert in Jiaojiang District, leader of model worker innovation studio for high-skilled talents in Jiaojiang District, outstanding skilled talents in Jiaojiang District, and practical talents in enterprises in Jiaojiang District. Engaged in sewing machine development and technological innovation for 18 years, presided over and participated in the development of more than 30 new products and more than 50 new technologies. Drafted one group standard of Zhejiang Manufacturing and one group standard of "Made in Zhejiang", published two papers, obtained more than 40 authorized invention patents and more than 50 utility model patents, and trained more than 10 technical business backbones for the company, including 3 technicians and 3 senior engineers.

Wang Hui

Wang Hui, male, born in September, 1983 in Taizhou, Zhejiang Province, party member, graduated from Dalian University of Technology as a fitter technician and mechanical engineer, and now works for Jack Technology Co., Ltd. as the quality director of metalworking workshop, mainly responsible for the design and debugging of process/fixture, workshop project transformation and workshop quality management. Zhejiang craftsman, Taizhou craftsman, Taizhou technical expert, Taizhou youth post expert, four-star Taizhou mechanic and other honors. Participated in the research and development of more than 20 new products, process and tooling design, and five rationalization suggestions for safety production won the honor of "Top Ten Golden Ideas" and "Silver Ideas" in the city; Published 2 papers and won 1 utility model patent; Technical innovation, 9 production line projects have a total of more than 100 innovations, saving nearly 6.5 million yuan/year; A number of studies won the first and second place in QCC improvement achievements of enterprises.

Mingming Fan

Mingming Fan, male, born in July, 1987 in Quzhou, Zhejiang Province, party member, senior technician of CNC lathe, leader of the workshop of famous CNC lathe machining technicians in Mingming Fan, Taizhou, and leader of the workshop of Mingming Fan skill masters in Jiaojiang District, now works in Taizhou Technical School as a mechanical professional teacher and senior practice instructor. He was awarded the honors of Zhejiang Technical Expert, Taizhou Chief Technician, Taizhou Excellent Instructor of CNC Car, Taizhou Excellent Instructor of Comprehensive Processing, Jiaojiang Excellent Skilled Talents, Jiaojiang Top Ten Skilled Experts, Jiaojiang Youth Post Expert and Jiaojiang Outstanding Youth Pioneer. He won the first prize 3 times and the second prize 2 times in Zhejiang CNC Competition. Publish 3 textbooks, one as the chief editor and one as the deputy chief editor; Published 5 professional and technical papers; Presided over 4 provincial and municipal projects and participated in 6 provincial and municipal projects; The students have won many awards in national, provincial and municipal numerical control skill competitions.

Zheng jiazheng

Zheng Jiazheng, male, born in September 1999 in Taizhou, Zhejiang Province, graduated from Hangzhou Wanxiang Vocational and Technical College as a CNC lathe technician, and now works for Zhejiang Chengxin Medical Equipment Co., Ltd. as a CNC machining technician, mainly responsible for CNC lathe processing programming and process improvement. Won the honor of Zhejiang craftsman, Zhejiang young craftsman, Taizhou craftsman, Taizhou technical expert, Jiaojiang craftsman, Jiaojiang technical expert and so on. Participated in the national 3D digital innovative design competition and won the first prize and the third prize respectively in Zhejiang Selection Competition, the first prize in Taizhou Vocational Skills Competition and the third prize in Taizhou Youth Vocational Skills Competition. Participated in more than ten technical transformation projects of the company, and solved technical problems for the company.

Chen zhong

Chen Zhong, male, born in February, 1977 in Baishan, Jilin Province, graduated from Dalian University of Technology, and is a senior technician and engineer of equipment inspection. Now he works for Zhejiang Haixiang Pharmaceutical Co., Ltd. as the technical director of engineering equipment, responsible for the daily operation and maintenance, technical upgrading and technological innovation of enterprise equipment production lines. He was honored as a Zhejiang craftsman, a "100 million" high-skilled leading talent in Zhejiang Province, an "outstanding high-skilled leading talent" in Quzhou City, Zhejiang Province, a "scientific expert" in Zhejiang Science and Technology Department, a Taizhou craftsman, a five-star Taizhou mechanic and a Jiaojiang craftsman. Declared 8 invention patents, 7 utility model patents and 4 chief editor’s papers. Trained 2 senior technicians, 4 technicians, 1 young craftsman from Zhejiang and 2 four-star Taizhou technicians. His apprentice won the first place in Taizhou Electrician Competition, the May 1st Labor Medal from Taizhou, the Golden Blue Collar from Jiaojiang and the second place in Jiaojiang District Electrician Competition.

Nie Yujian

Nie Yujian, male, born in Taizhou, Zhejiang Province in February 1999, graduated from zhejiang mechanical and electrical Vocational and Technical College, and is an ordinary lathe/CNC lathe technician. Now he works in Zhejiang Tongyu Variable Speed Machinery Co., Ltd. as a lathe/milling worker of fixture group, mainly responsible for the trial production and processing of fixture. He was awarded the second prize of Zhejiang Craftsman, Zhejiang Young Craftsman, Zhejiang Workers’ Lathe Vocational Skills Competition, the first prize of Taizhou Second Vocational Skills Grand Racer, Taizhou Skills Master, Taizhou May 1st Labor Medal, Jiaojiang District Technical Expert and other honors. Participate in the company’s multi-station four-sided milling technology of reducer box, grinding technology of reducer transmission shaft, trial-manufacture and processing of various fixtures such as various boring and milling rods and assembly tools.

Source: Jiaojiang Labor and Personnel

Editor: Ye Yuxin

Editor: Zhang Qi

Original title: "Provincial List, 8 people in Jiaojiang"

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　　[car home News] A few days ago, a Tesla China owner asked Musk on social media, "I expect Tesla FSD (fully autonomous driving) to enter China as soon as possible. I don’t know when it will be realized. When can HW3.0 system model images in 3D? When can the new parking assist be pushed to the owner of Tesla HW3.0 in China? "In this regard, Musk replied that "it may be realized soon.".At the same time, we can see that Tesla’s website shows that Tesla has reduced the price of fully automatic driving (FSD) package from $12,000 to $8,000 in the United States.

　　Since March this year, Tesla has started to deploy its software update to promote the latest FSD V12.3 beta version, which was integrated into the software update of 2023.44.30.25. Tesla CEO elon musk bluntly said: "This is a major release, and it can be said that it should be called V13."

　　Since its first launch on October 20, 2020, FSD has only been available in Beta in North America. Tesla released new software updates through beta to verify its latest autonomous driving technology and improve performance. At present, the system can’t realize full automatic driving, and it needs the supervision of the driver.

　　Last November, it was reported that Tesla FSD Beta was about to enter China. Tesla China official website updated the owner’s manual of China with FSD Beta, which indicates that FSD will soon land in China. Taking the new Tesla Model 3 as an example, it costs 64,000 yuan to install the FSD. After the installation, it can realize the functions of recognizing and responding to traffic lights and stop signs, and automatically assisting driving in urban streets.

　　Tesla has made a lot of preparations before landing in FSD in China. In 2021, a data center was established in Shanghai. All data generated by China business, including production data, sales data, service data and charging data, are completely stored in China to meet regulatory requirements. In addition, Tesla set up an FSD operation team and a data labeling team in Shanghai, and sent engineers from this department to do training. However, Tesla China once responded to the domestic media that "it is really in progress at present". (Compile/car home Wang Yin)